电子学报 ›› 2009, Vol. 37 ›› Issue (2): 253-257.

• 论文 • 上一篇    下一篇

电迁移致无铅钎料微互连焊点的 脆性蠕变断裂行为

尹立孟, 张新平   

  1. 华南理工大学材料科学与工程学院,广东广州 510640
  • 收稿日期:2008-02-25 修回日期:2008-05-19 出版日期:2009-02-25 发布日期:2009-02-25

Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections

YIN Li-meng, ZHANG Xin-ping   

  1. School of Materials Science and Engineering,South China University of Technology,Guangzhou,Guangdong 510640
  • Received:2008-02-25 Revised:2008-05-19 Online:2009-02-25 Published:2009-02-25

摘要: 研究了电迁移条件下不同电流密度(0.8~1.27×104A/cm2)和通电时间(0~96 h)对无铅钎料模拟微互连焊点的蠕变断裂行为的影响.研究结果发现,电迁移作用加速了焊点的蠕变断裂过程,随着电迁移通电时间的延长及电流密度的增加,其蠕变应变速率显著增大,而蠕变寿命逐渐缩短;电迁移还导致焊点蠕变断裂机制发生明显变化,在高电流密度或长时间通电的电迁移后,微互连焊点在服役条件下会发生由延性断裂向脆性断裂的转变.

关键词: 电迁移, 无铅钎料, 焊点, 蠕变, 断裂

Abstract: The influence of electromigration on creep fracture behavior of lead-free solder micro-interconnections was characterized under different current densities(0.8~1.27×104A/cm2)and holding times(0~96 hours).The experiment results show that the creep damage process of the lead-free solder interconnected joints is obviously accelerated by electromigration effect,and the increases in both current density and holding time lead to an increase of creep strain rate and a decrease of creep lifetime of the joints.In addition,the electromigration effect leads to fracture mode transition phenomena at the cathode interface of the solder joints,that is,from ductile fracture in the joints without electromigration to brittle fracture for those after strong electromigration using high current density and long holding time.

Key words: electromigration, lead-free, solder joints, creep, fracture

中图分类号: