Wrapper Scan Chains Optimization Based on Span and Virtual Layers for Three Dimensional Cores
LIU Jun1,2, WU Xi1,2, PEI Song-wei3, WANG Wei1,2, CHEN Tian1,2
1. School of Computer and Information, Hefei University of Technology, Hefei, Anhui 230009, China;
2. Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent Machine, Hefei University of Technology, Hefei, Anhui 230009, China;
3. College of Information Science and Technology, Beijing University of Chemical Technology, Beijing 100029, China
To reduce test time and test cost for pre-bond and post-bond test of three dimensional embedded cores, this paper proposed an optimization method based on span and virtual layers for wrapper scan chains in three dimensional embedded cores.Firstly, the proposed technique made the number of wrapper scan chains in high layers and low layers as equal as possible by maximizing the span of wrapper scan chains.Then, under the constraints of TSVs(Through Silicon Vias)number, the scan elements contained in virtual layers were assigned to wrapper scan chains layer by layer, which effectively balanced the length of pre-bond and post-bond wrapper chains.Experimental results show the presented methodology can greatly reduce the pre-bond/post-bond test time and hardware overhead for three dimensional embedded cores.
刘军, 吴玺, 裴颂伟, 王伟, 陈田. 基于跨度和虚拟层的三维芯核测试外壳扫描链优化方法[J]. 电子学报, 2015, 43(3): 454-459.
LIU Jun, WU Xi, PEI Song-wei, WANG Wei, CHEN Tian. Wrapper Scan Chains Optimization Based on Span and Virtual Layers for Three Dimensional Cores. Chinese Journal of Electronics, 2015, 43(3): 454-459.
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2015, Vol. 43 
