@article{方芳_2263, author = {[方芳, 秦振陆, 王伟, 朱侠, 郭二辉, 任福继]}, title = {3D芯片绑定中测试绑定次序对成本的影响}, publisher = {电子学报}, year = {2017}, journal = {电子学报}, volume = {45}, number = {9}, eid = {2263}, pages = {2263-2271}, keywords = {丢弃成本;成本模型;绑定次序;绑定中测试;测试次数优化}, doi = https://www.ejournal.org.cn/CN/10.3969/j.issn.0372-2112.2017.09.030 }