@article{左小寒_805, author = {[左小寒, 梁华国, 倪天明, 杨兆, 束月, 蒋翠云, 鲁迎春]}, title = {基于间隔分组的TSV聚簇故障冗余结构}, publisher = {电子学报}, year = {2021}, journal = {电子学报}, volume = {49}, number = {4}, eid = {805}, pages = {805-811}, keywords = {三维集成电路;硅通孔;聚簇故障;间隔分组;冗余修复}, doi = https://www.ejournal.org.cn/CN/10.12263/DZXB.20190957 }