基于再流焊冷却过程应力分析的板极组件BGA焊点参数优化
唐香琼, 黄春跃, 梁颖, 匡兵, 赵胜军
Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process
TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, KUANG Bing, ZHAO Sheng-jun
电子学报
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2020, (6): 1117
-1123
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DOI: 10.3969/j.issn.0372-2112.2020.06.011
