基于扭转载荷的微尺度CSP焊点应力应变分析与优化
梁颖, 黄春跃, 邹涯梅, 高超, 匡兵
Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load
LIANG Ying, HUANG Chun-yue, ZOU Ya-mei, GAO Chao, KUANG Bing
电子学报
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2020, (10): 2033
-2040
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DOI: 10.3969/j.issn.0372-2112.2020.10.022
