基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化

doi:10.3969/j.issn.0372-2112.2019.03.031

电子学报 ›› 2019, Vol. 47 ›› Issue (3): 734-740.DOI: 10.3969/j.issn.0372-2112.2019.03.031

基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化

王建培¹, 黄春跃¹, 梁颖², 邵良滨³

1. 桂林电子科技大学机电工程学院, 广西桂林 541004;
2. 成都航空职业技术学院电子工程系, 四川成都 610021;
3. 安徽神剑科技股份有限公司, 安徽合肥 230022

收稿日期:2018-02-08 修回日期:2018-09-06 出版日期:2019-03-25 发布日期:2019-03-25
通讯作者: 黄春跃
作者简介:王建培 女,1992年7月出生于河北邢台.桂林电子科技大学机械工程硕士.研究方向为微电子封装与组装可靠性技术.E-mail:1260381899@qq.com
基金资助:
国家自然科学基金（No.51465012）；四川省科技计划资助项目（No.2018JY0292）；军委装备发展部"十三五"装备预研领域基金项目

Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm

WANG Jian-pei¹, HUANG Chun-yue¹, LIANG Ying², SHAO Liang-bin³

1. School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China;
2. Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu, Sichuan 610021, China;
3. Anhui Shenji Polytorn Technologies Inc, Hefei, Anhui 230022, China

Received:2018-02-08 Revised:2018-09-06 Online:2019-03-25 Published:2019-03-25

摘要/Abstract

摘要： 建立了球栅阵列BGA（Ball Grid Array）焊点有限元分析模型，选取焊点高度、焊点最大径向尺寸、上焊盘直径和下焊盘直径作为设计变量，以焊点应力作为目标值，采用响应曲面法设计了29组不同水平组合的焊点模型并建模进行仿真计算，建立了焊点应力与结构参数的回归方程，基于回归方程结合遗传算法对焊点结构参数进行了优化，获得了焊点应力最小的结构参数最优水平组合.结果表明：对于无铅焊料SAC387，焊点应力随焊点的高度增加而减小，随最大径向尺寸的减小而减小；应力最小的焊点水平组合为：焊点高度0.38mm、最大径向尺寸0.42mm、上焊盘直径0.34mm和下焊盘直径0.35mm；对最优水平组合仿真验证表明优化后焊点最大应力下降了4.66MPa，实现了BGA焊点的结构优化.

关键词: BGA焊点, 热应力, 回归分析, 遗传算法, 功率载荷

Abstract: The finite element analysis model of BGA (Ball Grid Array) solder joints is established.The height of solder joints,the maximum radial dimension of solder joints,the diameter of upper and lower solder joints are selected as design variables,and the stress of solder joints is taken as target value.29 groups of solder joints with different levels are designed and simulated by response surface methodology.The regression equation of solder joint stress and structural parameters is established.The structural parameters of solder joint are optimized based on the regression equation and genetic algorithm,and the optimal level combination of structural parameters with minimum solder joint stress is obtained.The results show that for lead-free solder SAC387,the solder joint stress decreases with the increase of solder joint height,and decreases with the decrease of maximum radial dimension;the combination of solder joint level with minimum stress is:solder joint height 0.38mm,maximum radial dimension 0.42mm,upper pad diameter 0.34mm and lower pad diameter 0.35mm.The results show that the maximum stress of the solder joint decreases by 4.66MPa after optimization,and the structure optimization of BGA solder joint is realized.

Key words: BGA solder joint, thermal stress, regression analysis, genetic algorithm, power load

中图分类号:

TG404

王建培, 黄春跃, 梁颖, 邵良滨. 基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化[J]. 电子学报, 2019, 47(3): 734-740.

WANG Jian-pei, HUANG Chun-yue, LIANG Ying, SHAO Liang-bin. Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm[J]. Acta Electronica Sinica, 2019, 47(3): 734-740.

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基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化

Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm

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