QFP封装互连结构电气特性建模与退化分析
胡家兴, 景博, 黄以锋, 盛增津, 陈垚君, 张钰林
Electrical Characteristics Modeling and Degradation Analysis of QFP Package Interconnect Structure
HU Jia-xing, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, CHEN Yao-jun, ZHANG Yu-lin
电子学报
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2019, (2): 366
-373
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DOI: 10.3969/j.issn.0372-2112.2019.02.016
