基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化
王建培, 黄春跃, 梁颖, 邵良滨
Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm
WANG Jian-pei, HUANG Chun-yue, LIANG Ying, SHAO Liang-bin
电子学报
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2019, (3): 734
-740
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DOI: 10.3969/j.issn.0372-2112.2019.03.031
