基于边沿延时翻转的绑定前硅通孔测试方法
倪天明, 常郝, 卞景昌, 易茂祥, 梁华国, 黄正峰
An Edge Transition Delay Based Pre-Bond TSV Testing Method
NI Tian-ming, CHANG Hao, BIAN Jing-chang, YI Mao-xiang, LIANG Hua-guo, HUANG Zheng-feng
电子学报
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2019, (11): 2278
-2283
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DOI: 10.3969/j.issn.0372-2112.2019.11.006