2TF:一种协同考虑过硅通孔和热量的三维芯片布图规划算法
王伟;张欢;方芳;陈田;刘军;李欣;邹毅文
2TF: A Collaborative Considered TSV and Thermal Floorplanning Algorithm for Three-Dimensional Chip
WANG Wei;ZHANG Huan;FANG Fang;CHEN Tian;LIU Jun;LI Xin;ZOU Yi-wen
电子学报
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2012, (5): 971
-976
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DOI: 10.3969/j.issn.0372-2112.2012.05.017
