A TSV Redundancy Architecture for Clustered Faults Based on Interval Grouping

ZUO Xiao-han, LIANG Hua-guo, NI Tian-ming, YANG Zhao, SHU Yue, JIANG Cui-yun, LU Ying-chun

ACTA ELECTRONICA SINICA ›› 2021, Vol. 49 ›› Issue (4) : 805-811.

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ACTA ELECTRONICA SINICA ›› 2021, Vol. 49 ›› Issue (4) : 805-811. DOI: 10.12263/DZXB.20190957
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A TSV Redundancy Architecture for Clustered Faults Based on Interval Grouping

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 49(4): 805-811. https://doi.org/10.12263/DZXB.20190957

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