Miniaturization Design and Implementation of W-Band Micro-Coaxial Antenna Based on Wafer-Level Packaging

LIU Bo-yuan, JIANG Yun, HUANG Zhao-yu, CHEN Jia-bei, YE Yuan, JI Peng-fei, XU Qing-hua, WU Wei-wei, HUANG Jing-jian, YUAN Nai-chang

ACTA ELECTRONICA SINICA ›› 2022, Vol. 50 ›› Issue (5) : 1098-1106.

PDF(4971 KB)
CIE Homepage  |  Join CIE  |  Login CIE  |  中文 
PDF(4971 KB)
ACTA ELECTRONICA SINICA ›› 2022, Vol. 50 ›› Issue (5) : 1098-1106. DOI: 10.12263/DZXB.20210563
PAPERS

Miniaturization Design and Implementation of W-Band Micro-Coaxial Antenna Based on Wafer-Level Packaging

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 50(5): 1098-1106. https://doi.org/10.12263/DZXB.20210563

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(4971 KB)

Accesses

Citation

Detail
Sections
Recommended
Copyright © ACTA ELECTRONICA SINICA, All Rights Reserved.
E-mail：new@ejournal.org.cn
Powered by Beijing Magtech Co. Ltd,.
Copyright © ACTA ELECTRONICA SINICA, All Rights Reserved.

/

〈 〉