Method-Level Software Bug Localization Enhanced with File Information

Method-Level Software Bug Localization Enhanced with File Information

BO Li-li, ZHU Cheng, LI Bin, SUN Xiao-bing

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (3) : 613-621.

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (3) : 613-621. DOI: 10.12263/DZXB.20210878

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Method-Level Software Bug Localization Enhanced with File Information

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(3): 613-621. https://doi.org/10.12263/DZXB.20210878

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