Integrated 3D Fan-Out Package of RF Microsystem and Antenna for 5G Communication

XIA Chen-hui, WANG Gang, WANG Bo, MING Xue-fei

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (6) : 1572-1580.

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (6) : 1572-1580. DOI: 10.12263/DZXB.20210991
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Integrated 3D Fan-Out Package of RF Microsystem and Antenna for 5G Communication

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(6): 1572-1580. https://doi.org/10.12263/DZXB.20210991

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