A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding

LIU Jun, XIA Shan-hong, PENG Chun-rong, CHU Zhao-zhi, LEI Hu-cheng, LIU Xiang-ming, ZHANG Zhou-wei, ZHANG Wei, PENG Si-min, GAO Ya-hao

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (9) : 2517-2525.

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (9) : 2517-2525. DOI: 10.12263/DZXB.20211364
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A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(9): 2517-2525. https://doi.org/10.12263/DZXB.20211364

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