Thermal Disturbance Effect of Phase Change Random Access Memory Array Based on Blade-Type Structure

LIAN Xiao-juan, GAO Zhi-xuan, FU Jin-ke, WANG Lei

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (2) : 396-405.

PDF(1495 KB)
CIE Homepage  |  Join CIE  |  Login CIE  |  中文 
PDF(1495 KB)
ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (2) : 396-405. DOI: 10.12263/DZXB.20211548
PAPERS

Thermal Disturbance Effect of Phase Change Random Access Memory Array Based on Blade-Type Structure

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(2): 396-405. https://doi.org/10.12263/DZXB.20211548

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1495 KB)

Accesses

Citation

Detail
Sections
Recommended
Copyright © ACTA ELECTRONICA SINICA, All Rights Reserved.
E-mail：new@ejournal.org.cn
Powered by Beijing Magtech Co. Ltd,.
Copyright © ACTA ELECTRONICA SINICA, All Rights Reserved.

/

〈 〉