W Band Active Phased Array Micro System Based on Silicon Three Dimensional Integration Technique

YANG Jia-peng, ZHOU Jun, CAO Zhi-xiang, MENG Hong-fu, SHEN Ya

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (8) : 2160-2167. DOI: 10.12263/DZXB.20220054

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W Band Active Phased Array Micro System Based on Silicon Three Dimensional Integration Technique

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(8): 2160-2167. https://doi.org/10.12263/DZXB.20220054

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