Research on Thermal Analysis Method of 3D-stacked MRAM

Research on Thermal Analysis Method of 3D-stacked MRAM

YONG Ruo-xue, JIANG Yan-feng

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (10) : 2775-2782.

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (10) : 2775-2782. DOI: 10.12263/DZXB.20220275

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Research on Thermal Analysis Method of 3D-stacked MRAM

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(10): 2775-2782. https://doi.org/10.12263/DZXB.20220275

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