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Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration
YANG Xue-xia, SUN Qin-run, WANG Chao, PENG Yin-fei, ZHANG Wei-wei
ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (10) : 2783-2790.
PDF(1435 KB)
PDF(1435 KB)
Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration
A board-level BGA (Ball Grid Array) solder joint finite element model is established. The chip height, solder joint diameter, solder joint height, and solder joint spacing are selected as design variables, and the critical solder joint stress is used as the response target. We design 25 groups of solder joint models simulating and calculating based on the Taguchi orthogonal and the surface response method The structural parameters of the solder joints are optimized through mathematical statistical and regression analysis. And the optimal solder structural combination with the minimum joint stress is obtained. The results show that the result of surface response optimization is better than the Taguchi orthogonal under the same conditions. And the best combination of solder joints is solder joint diameter 0.32 mm, solder joint height 0.20 mm, solder joint spacing 0.36 mm. The equivalent stress value of the best combination is 0.391 5 MPa, which is reduced by 0.65 MPa. They show that the optimization of the structural parameters of BGA solder joints is achieved.
BGA solder joint / taguchi orthogonal / surface response / finite element {{custom_keyword}} /
表1 FBGA模型材料属性及尺寸 |
| 材料 | 弹性模量E/GPa | 泊松比μ | 密度ρ/(kg∙m-3) |
|---|---|---|---|
| Si芯片 | 131 | 0.30 | 2 320 |
| SAC305 | 38 | 0.35 | 7 300 |
| PCB板 | 18.2 | 0.25 | 1 200 |
表2 控制因素及水平因子 |
| 因素 名称 | 芯片高度/mm | 焊点直径/mm | 焊点高度/mm | 焊点间距/mm |
|---|---|---|---|---|
| A | B | C | D | |
| 水平1 | 0.390 | 0.28 | 0.190 | 0.36 |
| 水平2 | 0.395 | 0.29 | 0.195 | 0.37 |
| 水平3 | 0.400 | 0.30 | 0.200 | 0.38 |
| 水平4 | 0.405 | 0.31 | 0.205 | 0.39 |
| 水平5 | 0.410 | 0.32 | 0.210 | 0.40 |
表3 正交实验方案及信噪比响应 |
| 试验 | A/mm | B/mm | C/mm | D/mm | σ/MPa | 信噪比D S/N/dB |
|---|---|---|---|---|---|---|
| 1 | 1 | 1 | 1 | 1 | 0.644 4 | 3.816 9 |
| 2 | 1 | 2 | 2 | 2 | 0.616 1 | 4.206 9 |
| 3 | 1 | 3 | 3 | 3 | 0.625 6 | 4.074 1 |
| 4 | 1 | 4 | 4 | 4 | 0.617 8 | 4.183 1 |
| 5 | 1 | 5 | 5 | 5 | 0.597 7 | 4.470 3 |
| 6 | 2 | 1 | 2 | 3 | 0.568 7 | 4.902 3 |
| 7 | 2 | 2 | 3 | 4 | 0.570 4 | 4.876 4 |
| 8 | 2 | 3 | 4 | 5 | 0.521 4 | 5.656 5 |
| 9 | 2 | 4 | 5 | 1 | 0.462 3 | 6.701 5 |
| 10 | 2 | 5 | 1 | 2 | 0.591 9 | 4.555 1 |
| 11 | 3 | 1 | 3 | 5 | 0.595 4 | 4.503 8 |
| 12 | 3 | 2 | 4 | 1 | 0.565 2 | 4.955 9 |
| 13 | 3 | 3 | 5 | 2 | 0.625 7 | 4.072 7 |
| 14 | 3 | 4 | 1 | 3 | 0.657 8 | 3.638 1 |
| 15 | 3 | 5 | 2 | 4 | 0.626 3 | 4.064 4 |
| 16 | 4 | 1 | 4 | 2 | 0.565 5 | 4.951 3 |
| 17 | 4 | 2 | 5 | 3 | 0.580 2 | 4.728 4 |
| 18 | 4 | 3 | 1 | 4 | 0.605 1 | 4.363 5 |
| 19 | 4 | 4 | 2 | 5 | 0.584 2 | 4.668 8 |
| 20 | 4 | 5 | 3 | 1 | 0.574 9 | 4.808 2 |
| 21 | 5 | 1 | 5 | 4 | 0.505 4 | 5.927 3 |
| 22 | 5 | 2 | 1 | 5 | 0.582 2 | 4.698 6 |
| 23 | 5 | 3 | 2 | 1 | 0.512 3 | 5.809 5 |
| 24 | 5 | 4 | 3 | 2 | 0.608 9 | 4.309 1 |
| 25 | 5 | 5 | 4 | 3 | 0.723 6 | 2.810 1 |
| 均值 | 4.630 1 | |||||
| K 1 | 4.150 3 | 4.820 3 | 4.214 4 | 5.218 4 | 因素主次:A>D>C>B 优化设计:A2B1C5D1 | |
| K 2 | 5.338 4 | 4.693 2 | 4.730 4 | 4.419 1 | ||
| K 3 | 4.246 9 | 4.795 3 | 4.514 3 | 4.030 6 | ||
| K 4 | 4.704 1 | 4.700 1 | 4.511 4 | 4.682 9 | ||
| K 5 | 4.710 9 | 4.141 6 | 5.180 1 | 4.799 6 | ||
| R | 1.188 1 | 0.678 7 | 0.965 7 | 1.187 8 | ||
表4 因素显著性水平 |
| 因素 | A | B | C | D |
|---|---|---|---|---|
| 偏差平方和/mm | 0.019 | 0.007 | 0.011 | 0.018 |
| 自由度/mm | 4 | 4 | 4 | 4 |
| F比/m | 9.5 | 3.5 | 5.5 | 9.0 |
| 贡献率/% | 34.55 | 12.73 | 19.99 | 32.73 |
| 显著性 | 显著 | 不显著 | 不显著 | 显著 |
表5 BBD试验方案及等效应力结果 |
| 试验 | A/mm | B/mm | C/mm | D/mm | σ/MPa |
|---|---|---|---|---|---|
| 1 | 3 | 3 | 3 | 3 | 0.471 9 |
| 2 | 1 | 1 | 3 | 3 | 0.576 1 |
| 3 | 5 | 1 | 3 | 3 | 0.552 1 |
| 4 | 1 | 5 | 3 | 3 | 0.460 6 |
| 5 | 5 | 5 | 3 | 3 | 0.443 5 |
| 6 | 3 | 3 | 1 | 1 | 0.420 7 |
| 7 | 3 | 3 | 5 | 1 | 0.452 2 |
| 8 | 3 | 3 | 1 | 5 | 0.577 5 |
| 9 | 3 | 3 | 5 | 5 | 0.578 5 |
| 10 | 1 | 3 | 3 | 1 | 0.412 6 |
| 11 | 5 | 3 | 3 | 1 | 0.427 2 |
| 12 | 1 | 3 | 3 | 5 | 0.586 1 |
| 13 | 5 | 3 | 3 | 5 | 0.554 8 |
| 14 | 3 | 1 | 1 | 3 | 0.591 6 |
| 15 | 3 | 5 | 1 | 3 | 0.471 9 |
| 16 | 3 | 1 | 5 | 3 | 0.544 6 |
| 17 | 3 | 5 | 5 | 3 | 0.443 6 |
| 18 | 1 | 3 | 1 | 3 | 0.527 9 |
| 19 | 5 | 3 | 1 | 3 | 0.544 5 |
| 20 | 1 | 3 | 5 | 3 | 0.489 6 |
| 21 | 5 | 3 | 5 | 3 | 0.498 6 |
| 22 | 3 | 1 | 3 | 1 | 0.496 8 |
| 23 | 3 | 5 | 3 | 1 | 0.399 5 |
| 24 | 3 | 1 | 3 | 5 | 0.630 8 |
| 25 | 3 | 5 | 3 | 5 | 0.546 4 |
表6 筛选前方差显著性分析 |
| 来源 | 自由度 | Adj SS | Adj MS | F值 | P值 |
|---|---|---|---|---|---|
| 模型 | 4 | 0.103 93 | 0.007 42 | 25.67 | 0.000 67 |
| 芯片高度 | 1 | 0.000 09 | 0.000 09 | 0.30 | 0.596 25 |
| 焊点直径 | 1 | 0.033 60 | 0.033 60 | 116.17 | 0.000 35 |
| 焊点高度 | 1 | 0.001 35 | 0.001 35 | 4.65 | 0.000 52 |
| 焊点间距 | 1 | 0.063 58 | 0.063 58 | 219.83 | 0.000 21 |
表7 筛选前回归方程分析 |
| FitStatistics(统计数据) | 值 |
|---|---|
| R-Square(回归方程系数) | 96.77% |
| Adj. R-Square(回归方程调整系数) | 93.00% |
| Pre. R-Square(回归方程预测系数) | 81.39% |
| FitStatus(拟合情况) | Succeeded |
表8 筛选后方差显著性分析 |
| 来源 | 自由度 | Adj SS | Adj MS | F值 | P值 |
|---|---|---|---|---|---|
| 模型 | 3 | 0.101 799 | 0.016 966 | 60.56 | 0.000 2 |
| 焊点直径 | 1 | 0.033 602 | 0.033 602 | 119.93 | 0.000 7 |
| 焊点高度 | 1 | 0.001 345 | 0.001 345 | 4.80 | 0.000 4 |
| 焊点间距 | 1 | 0.063 583 | 0.063 583 | 226.93 | 0.000 3 |
表9 筛选后回归方程分析 |
| FitStatistics(统计数据) | 值 |
|---|---|
| R-Square(回归方程系数) | 98.78% |
| Adj. R-Square(回归方程调整系数) | 93.22% |
| Pre. R-Square(回归方程预测系数) | 90.21% |
| FitStatus(拟合情况) | Succeeded |
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PDF(1435 KB)
图1 3D BGA封装样式
表1 FBGA模型材料属性及尺寸图2 PSD功率谱密度图3 全结构焊点等效应力分布表2 控制因素及水平因子表3 正交实验方案及信噪比响应图4 信噪比均值效应表4 因素显著性水平图5 BGA芯片高度、焊点间距因素交互图6 优化组合焊点等效应力云图图7 曲面响应优化流程图表5 BBD试验方案及等效应力结果表6 筛选前方差显著性分析表7 筛选前回归方程分析表8 筛选后方差显著性分析表9 筛选后回归方程分析图8 标准化效应Pareto图图9 标准化效应正态图图10 拟合函数诊断标准化残差图图11 适应度函数种群最优解及均值变化图12 最优水平组合板级FBGA焊点等效应力图
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