Research on Terahertz Monolithic Integrated Power Amplifier Package

ZHANG Bo, ZHANG Yong, JIANG Wei-jia, LIU Guang-ru, XU Rui-min, YAN Bo

ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (10) : 2724-2732.

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ACTA ELECTRONICA SINICA ›› 2023, Vol. 51 ›› Issue (10) : 2724-2732. DOI: 10.12263/DZXB.20221317
THz metasuface technology and application

Research on Terahertz Monolithic Integrated Power Amplifier Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(10): 2724-2732. https://doi.org/10.12263/DZXB.20221317

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