Package Test and Output Characteristics of GaN-Based Hetero Junction Structure Hall Sensors

MA Kai-ming, DAI Jian-xun, ZHANG Hui, DING Nan-nan, SUN Nan, SUN Zhong-hao, LIU Yan-hong, LIANG Yung C, HUANG Huo-lin

ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (8) : 2737-2745.

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ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (8) : 2737-2745. DOI: 10.12263/DZXB.20230262
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Package Test and Output Characteristics of GaN-Based Hetero Junction Structure Hall Sensors

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 52(8): 2737-2745. https://doi.org/10.12263/DZXB.20230262

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