Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis

WANG Wei-jie, LIU Yan-nan, ZHAO Zhen-guo

ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (8) : 2718-2725.

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ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (8) : 2718-2725. DOI: 10.12263/DZXB.20230501
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Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 52(8): 2718-2725. https://doi.org/10.12263/DZXB.20230501

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