Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole

PENG Bo, WANG Ming-yang, GAN Zuo-teng, LIU Lin-jie, DU Ping-an

ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (11) : 3899-3906.

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ACTA ELECTRONICA SINICA ›› 2024, Vol. 52 ›› Issue (11) : 3899-3906. DOI: 10.12263/DZXB.20230998
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Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 52(11): 3899-3906. https://doi.org/10.12263/DZXB.20230998

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