Review on the Application of Metasurface-Based Impedance Matching Layer for Non-Destructive Testing Signal Enhancement

HAO Tong, ZHENG Wu-an, LI Xiao-jing

ACTA ELECTRONICA SINICA ›› 2025

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ACTA ELECTRONICA SINICA ›› 2025 DOI: 10.12263/DZXB.20241070

Review on the Application of Metasurface-Based Impedance Matching Layer for Non-Destructive Testing Signal Enhancement

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025 https://doi.org/10.12263/DZXB.20241070

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