2TF: A Collaborative Considered TSV and Thermal Floorplanning Algorithm for Three-Dimensional Chip

WANG Wei;ZHANG Huan;FANG Fang;CHEN Tian;LIU Jun;LI Xin;ZOU Yi-wen

ACTA ELECTRONICA SINICA ›› 2012, Vol. 40 ›› Issue (5) : 971-976.

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ACTA ELECTRONICA SINICA ›› 2012, Vol. 40 ›› Issue (5) : 971-976. DOI: 10.3969/j.issn.0372-2112.2012.05.017
学术论文

2TF: A Collaborative Considered TSV and Thermal Floorplanning Algorithm for Three-Dimensional Chip

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2012, 40(5): 971-976. https://doi.org/10.3969/j.issn.0372-2112.2012.05.017

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