The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

doi:10.3969/j.issn.0372-2112.2015.04.020

XIAO Xiang-hui, PENG Min-fang, HE Jian-biao, TANG Rong-jun, ZHOU Ying-liang

Acta Electronica Sinica ›› 2015, Vol. 43 ›› Issue (4) : 769-775.

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Acta Electronica Sinica ›› 2015, Vol. 43 ›› Issue (4) : 769-775. DOI: 10.3969/j.issn.0372-2112.2015.04.020

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(4): 769-775 https://doi.org/10.3969/j.issn.0372-2112.2015.04.020

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Received	Revised	Published
2014-05-21	2014-06-30	2015-04-25
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2015-04-25

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