The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

doi:10.3969/j.issn.0372-2112.2015.04.020

XIAO Xiang-hui, PENG Min-fang, HE Jian-biao, TANG Rong-jun, ZHOU Ying-liang

ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (4) : 769-775.

PDF(3331 KB)

ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (4) : 769-775. DOI: 10.3969/j.issn.0372-2112.2015.04.020

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(4): 769-775. https://doi.org/10.3969/j.issn.0372-2112.2015.04.020

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(3331 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Revised	Published
2014-05-21	2014-06-30	2015-04-25
Issue Date
2015-04-25

Please choose a citation manager

Content to export