Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset Under Thermal Cycling Load

WU Song, HUANG Chun-yue, LIANG Ying, LI Tian-ming, GUO Guang-kuo, XIONG Guo-ji, TANG Wen-liang

ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (6) : 1179-1184.

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ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (6) : 1179-1184. DOI: 10.3969/j.issn.0372-2112.2015.06.021

Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset Under Thermal Cycling Load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(6): 1179-1184. https://doi.org/10.3969/j.issn.0372-2112.2015.06.021

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