Study of Inter-Chip Wireless Connection with Mushroom-Type Metamaterial-Constructed Innovative PCB Channels

WANG Wen-song, CHEN Yin-chao, YANG Shu-hui, CAO Qun-sheng

ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (12) : 2455-2460.

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ACTA ELECTRONICA SINICA ›› 2015, Vol. 43 ›› Issue (12) : 2455-2460. DOI: 10.3969/j.issn.0372-2112.2015.12.016

Study of Inter-Chip Wireless Connection with Mushroom-Type Metamaterial-Constructed Innovative PCB Channels

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(12): 2455-2460. https://doi.org/10.3969/j.issn.0372-2112.2015.12.016

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