Optimization Strategy for TSV-Based 3D SoC Testing

SHEN Ke-le, YU Zhi-gang, BAI Yu

ACTA ELECTRONICA SINICA ›› 2016, Vol. 44 ›› Issue (1) : 155-159.

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ACTA ELECTRONICA SINICA ›› 2016, Vol. 44 ›› Issue (1) : 155-159. DOI: 10.3969/j.issn.0372-2112.2016.01.023

Optimization Strategy for TSV-Based 3D SoC Testing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 44(1): 155-159. https://doi.org/10.3969/j.issn.0372-2112.2016.01.023

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