Latent Fault Analysis of Board-Level Package for Electronics PHM Subjected to Vibration

TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, JIAO Xiao-xuan

ACTA ELECTRONICA SINICA ›› 2016, Vol. 44 ›› Issue (4) : 944-951.

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ACTA ELECTRONICA SINICA ›› 2016, Vol. 44 ›› Issue (4) : 944-951. DOI: 10.3969/j.issn.0372-2112.2016.04.027

Latent Fault Analysis of Board-Level Package for Electronics PHM Subjected to Vibration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 44(4): 944-951. https://doi.org/10.3969/j.issn.0372-2112.2016.04.027

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