Latent Fault Analysis of Board-Level Package for Electronics PHM Subjected to Vibration
TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, JIAO Xiao-xuan
Acta Electronica Sinica ›› 2016, Vol. 44 ›› Issue (4) : 944-951.
Latent Fault Analysis of Board-Level Package for Electronics PHM Subjected to Vibration
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