Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads
TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, HU Jia-xing
Acta Electronica Sinica ›› 2017, Vol. 45 ›› Issue (7) : 1613-1619.
Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads
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