Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads

TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, HU Jia-xing

ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (7) : 1613-1619.

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ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (7) : 1613-1619. DOI: 10.3969/j.issn.0372-2112.2017.07.010

Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(7): 1613-1619. https://doi.org/10.3969/j.issn.0372-2112.2017.07.010

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