The Influence of the Dielectric Properties of Dust Particles on Electrochemical Migration of Printed Circuit Board

ZHOU Yi-lin, ZHU Meng, HUO Yu-jia

ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (7) : 1758-1763.

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ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (7) : 1758-1763. DOI: 10.3969/j.issn.0372-2112.2017.07.028

The Influence of the Dielectric Properties of Dust Particles on Electrochemical Migration of Printed Circuit Board

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(7): 1758-1763. https://doi.org/10.3969/j.issn.0372-2112.2017.07.028

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