A Chip-Level Multi-parametric Yield Prediction Method Based on Copula Theory

LI Xin, TANG Jie, XIAO Fu

ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (9) : 2098-2105.

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ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (9) : 2098-2105. DOI: 10.3969/j.issn.0372-2112.2017.09.007

A Chip-Level Multi-parametric Yield Prediction Method Based on Copula Theory

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(9): 2098-2105. https://doi.org/10.3969/j.issn.0372-2112.2017.09.007

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