The Bonding Order's Impact on Cost During Mid-Bond Test of 3D Chip

FANG Fang, QIN Zhen-lu, WANG Wei, ZHU Xia, GUO Er-hui, REN Fu-ji

ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (9) : 2263-2271.

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ACTA ELECTRONICA SINICA ›› 2017, Vol. 45 ›› Issue (9) : 2263-2271. DOI: 10.3969/j.issn.0372-2112.2017.09.030

The Bonding Order's Impact on Cost During Mid-Bond Test of 3D Chip

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(9): 2263-2271. https://doi.org/10.3969/j.issn.0372-2112.2017.09.030

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