Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm

doi:10.3969/j.issn.0372-2112.2019.03.031

WANG Jian-pei, HUANG Chun-yue, LIANG Ying, SHAO Liang-bin

ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (3) : 734-740.

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ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (3) : 734-740. DOI: 10.3969/j.issn.0372-2112.2019.03.031

Thermal Stress Analysis and Optimization of BGA Solder Joint Power Load Based on Regression Analysis and Genetic Algorithm

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 47(3): 734-740. https://doi.org/10.3969/j.issn.0372-2112.2019.03.031

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Received	Revised	Published
2018-02-08	2018-09-06	2019-03-25
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2019-03-25

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