Solution to Temperature Field Measurement of the Ladle Based on Laser Positioning and Scanning

doi:10.3969/j.issn.0372-2112.2019.05.006

LIU Jun, MENG Xian-wu, CI Ying, FANG Jiang-xiong, HOU Qing-ming, CHE Zhong-xuan, YANG Feng

ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (5) : 1017-1022.

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ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (5) : 1017-1022. DOI: 10.3969/j.issn.0372-2112.2019.05.006

Solution to Temperature Field Measurement of the Ladle Based on Laser Positioning and Scanning

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 47(5): 1017-1022. https://doi.org/10.3969/j.issn.0372-2112.2019.05.006

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Received	Revised	Published
2018-10-11	2018-12-31	2019-05-25
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2019-05-25

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