The Impact of Body Effect on TID of Ultra Deep Sub Micron SOI Devices

XI Shan-xue, LU Wu, ZHENG Qi-wen, CUI Jiang-wei, WEI Ying, YAO Shuai, ZHAO Jing-hao, GUO Qi

ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (5) : 1065-1069.

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ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (5) : 1065-1069. DOI: 10.3969/j.issn.0372-2112.2019.05.013

The Impact of Body Effect on TID of Ultra Deep Sub Micron SOI Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 47(5): 1065-1069. https://doi.org/10.3969/j.issn.0372-2112.2019.05.013

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