An Edge Transition Delay Based Pre-Bond TSV Testing Method

NI Tian-ming, CHANG Hao, BIAN Jing-chang, YI Mao-xiang, LIANG Hua-guo, HUANG Zheng-feng

ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (11) : 2278-2283.

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ACTA ELECTRONICA SINICA ›› 2019, Vol. 47 ›› Issue (11) : 2278-2283. DOI: 10.3969/j.issn.0372-2112.2019.11.006

An Edge Transition Delay Based Pre-Bond TSV Testing Method

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 47(11): 2278-2283. https://doi.org/10.3969/j.issn.0372-2112.2019.11.006

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