Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process
TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, KUANG Bing, ZHAO Sheng-jun
Acta Electronica Sinica ›› 2020, Vol. 48 ›› Issue (6) : 1117-1123.
Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process
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