Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

doi:10.3969/j.issn.0372-2112.2020.06.011

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ACTA ELECTRONICA SINICA ›› 2020, Vol. 48 ›› Issue (6) : 1117-1123. DOI: 10.3969/j.issn.0372-2112.2020.06.011

Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

TANG Xiang-qiong¹, HUANG Chun-yue¹, LIANG Ying², KUANG Bing¹, ZHAO Sheng-jun¹

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Abstract

A finite element model of board level assembly BGA (Ball Grid Array) solder joint is established, the stress simulation analysis of BGA solder joint in the cooling process of reflow soldering is carried out, the confirmatory experiment is designed and carried out to verify the validity of simulation analysis method, and the influence of solder joint structure parameters and material on the stress and strain of solder joint are analyzed. The regression equations of the stress and structure parameters of the solder joints is established by the response surface method, and solder joint structure parameters are optimized by genetic algorithm. The results show that the experiment results verify the effectiveness of the simulation analysis, the stress of the solder joint increases with the increase of the height of the solder joint, and decreases with the increase of the diameter of the solder joint, and the optimal level combination of solder joint structure parameters is the height of 0.44mm, the diameter of 0.65mm, the pad diameter of 0.52mm and the solder joint pitch of 1.10mm, the simulation results of the optimal level combination of solder joint show that the maximum stress decreases by 0.1101MPa.

Key words

board level assembly BGA solder joint / cooling process of reflow / stress and strain / response surface analysis / genetic algorithm

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TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, KUANG Bing, ZHAO Sheng-jun. Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process[J]. Acta Electronica Sinica, 2020, 48(6): 1117-1123. https://doi.org/10.3969/j.issn.0372-2112.2020.06.011

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Funding

Program supported by Equipment Pre-research Field Fund of CMC Equipment Development Department during the 13th Five-year Plan; Science and Technology Major Project of Guangxi Zhuang Autonomous Region (Guangxi Academy of Sciences) (No.AA19046004); Program supported by Sichuan Science and Technology Program (No.2018JY0292)