Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load

doi:10.3969/j.issn.0372-2112.2020.10.022

LIANG Ying, HUANG Chun-yue, ZOU Ya-mei, GAO Chao, KUANG Bing

Acta Electronica Sinica ›› 2020, Vol. 48 ›› Issue (10) : 2033-2040.

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Acta Electronica Sinica ›› 2020, Vol. 48 ›› Issue (10) : 2033-2040. DOI: 10.3969/j.issn.0372-2112.2020.10.022

Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 48(10): 2033-2040 https://doi.org/10.3969/j.issn.0372-2112.2020.10.022

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Received	Revised	Published
2019-06-19	2019-12-26	2020-10-25
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2020-10-25

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