A Modified 3-D PEEC Model in Interconnect and Packaging Electric Analysis

A Modified 3-D PEEC Model in Interconnect and Packaging Electric Analysis

CAO Yi;LI Zheng-fan;MAO Ji-feng

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (2) : 65-67.

PDF(253 KB)

PDF(253 KB)

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (2) : 65-67.

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A Modified 3-D PEEC Model in Interconnect and Packaging Electric Analysis

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 28(2): 65-67.

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