Simulation of Interconnection and Package Effect in High-speed MCM

Simulation of Interconnection and Package Effect in High-speed MCM

MAO Ji-feng;LI Zheng-fai;CAO Yi;XU Qin-wei

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (5) : 130-132.

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PDF(160 KB)

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (5) : 130-132.

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Simulation of Interconnection and Package Effect in High-speed MCM

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 28(5): 130-132.

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