Simulation of Duplex Solder Joints Geometry in Flip-Chip Technology

Simulation of Duplex Solder Joints Geometry in Flip-Chip Technology

ZHU Qi-nong;WANG Guo-zhong;LUO Le

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (5) : 55-58.

PDF(249 KB)

PDF(249 KB)

ACTA ELECTRONICA SINICA ›› 2000, Vol. 28 ›› Issue (5) : 55-58.

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Simulation of Duplex Solder Joints Geometry in Flip-Chip Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 28(5): 55-58.

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