Thermal Analysis of the Ring-Plane TWT in the Interaction Area

Thermal Analysis of the Ring-Plane TWT in the Interaction Area

GONG Yu-bin;QIN Zhi-dong;WANG Wen-xiang;LAN Yong-hai;Li Xiao-yun

ACTA ELECTRONICA SINICA ›› 2002, Vol. 30 ›› Issue (12) : 1848-1852.

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PDF(328 KB)

ACTA ELECTRONICA SINICA ›› 2002, Vol. 30 ›› Issue (12) : 1848-1852.

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Thermal Analysis of the Ring-Plane TWT in the Interaction Area

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2002, 30(12): 1848-1852.

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