Numerical Simulation of Electric and Thermal Characteristic in ULSI Copper-Filled Inteconnect Via Hole

Numerical Simulation of Electric and Thermal Characteristic in ULSI Copper-Filled Inteconnect Via Hole

LI Zhi-guo;LU Zhen-jun

ACTA ELECTRONICA SINICA ›› 2003, Vol. 31 ›› Issue (7) : 1104-1106.

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PDF(249 KB)

ACTA ELECTRONICA SINICA ›› 2003, Vol. 31 ›› Issue (7) : 1104-1106.

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Numerical Simulation of Electric and Thermal Characteristic in ULSI Copper-Filled Inteconnect Via Hole

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2003, 31(7): 1104-1106.

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