On the Model of Microstrip Bonding Wire Interconnects for Millimeter Wave Applications

On the Model of Microstrip Bonding Wire Interconnects for Millimeter Wave Applications

XU Hong-fei, YIN Xiao-xing, SUN Zhong-liang

ACTA ELECTRONICA SINICA ›› 2003, Vol. 31 ›› Issue (S1) : 2015-2017.

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PDF(410 KB)

ACTA ELECTRONICA SINICA ›› 2003, Vol. 31 ›› Issue (S1) : 2015-2017.

On the Model of Microstrip Bonding Wire Interconnects for Millimeter Wave Applications

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2003, 31(S1): 2015-2017.

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