Three Dimensional Integrated Microwave Modules Based on LTCC Technology

Yan Wei;Yu Sheng-lin;Fang Xun-lei

ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (11) : 2009-2012.

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ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (11) : 2009-2012.
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Three Dimensional Integrated Microwave Modules Based on LTCC Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 33(11): 2009-2012.

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