Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design

Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design

HUANG Chun-yue, ZHOU De-jian, WU Zhao-hua

ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (5) : 788-792.

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PDF(207 KB)

ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (5) : 788-792.

Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 33(5): 788-792.

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