Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design
HUANG Chun-yue, ZHOU De-jian, WU Zhao-hua
Acta Electronica Sinica ›› 2005, Vol. 33 ›› Issue (5) : 788-792.
Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design
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