Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates

Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates

GUO Chun-sheng;LI Zhi-guo

ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (8) : 1519-1522.

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PDF(241 KB)

ACTA ELECTRONICA SINICA ›› 2005, Vol. 33 ›› Issue (8) : 1519-1522.

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Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 33(8): 1519-1522.

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